Overview
3D ICs are the most recent in the range of technology available for
medical imaging and are revolutionizing the way that health care is delivered.
They have given doctors a completely new range of options and have enabled them
to give better treatment to patients. The first reason why ICs are so useful is
they offer patients a wider range of features than ever before, thanks to the
advances that have been made in today's digital health industry. By using this
advanced method, doctors can access the latest information about their patients
in order to provide the best possible care. Doctors will have the ability to
view every single part of a patient's body, which allows them to make a more
informed decision about their treatment.
Market Drivers
Growing demand for advanced electronic products is expected to propel
the 3D ICs market growth over the forecast period. Advanced
electronic products are available in small and compact sizes. In fact, many
electronic products have been miniaturized and have witnessed massive demand
among consumers across the globe. Three-dimensional integrated circuits offer
an ideal solution to such devices since it allows high-performing microchips
with low power consumption. It also enables high-speed transmission, data
processing, as well as connectivity to smart devices, and enhanced storage
capacity. For instance, in August 2020, Samsung introduced a new 3D IC solution
eXtended-Cube (X-Cube) for next-generation applications including AI, 5G, and
AR &VR. Thus, these factors are expected to propel the 3D ICs market growth
over the forecast period. Moreover, the rapid development of high-performance
networking devices with large storage capacity is expected to boost 3D ICs
market growth over the forecast period.
Market Restraint
High-cost 3D ICs, which pose challenges to commercialization for
mainstream applications are expected to hinder the 3D ICs market growth over
the forecast period.
Market Opportunities
Rapid growth of the semiconductor sector can present lucrative growth
opportunities for market players in the near future.
Competitive Section
Major
companies operating in the 3D ICs market are Xilinx Inc., Intel Corporation,
Tezzaron Semiconductor Corporation, and Samsung Electronics, 3M Company,
Monolithic 3D Inc., United Microelectronics Corporation, and IBM Corporation.
For instance, in August 2020, Synopsys Inc. collaborated with TSMC to
deliver certified design flows for advanced packing solutions using Synopsys
3DIC Complier.
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